Another Use for Boron Nitride (Integrated Circuits)

Interesting... 3nm interconnects. My career was at Novellus (now Lam Research). Novellus bet the company on copper interconnects.
Copper was a better conductor than aluminum, but was thought to be an unsuitable material at small geometries.
In the late 1990's Novellus, jointly with IBM, developed copper deposition technology for interconnects and changed the semiconductor manufacturing world.
These were exciting times.
 
About the 1987 time frame I was working for the McDonnell Douglas Microelectronics Company (MDEC) as a physicist characterizing CMOS operating curves on wafers.

Back then the big deal in high speed IC's was using the insulator-substrate "sapphire" for the Silicon-On-Sapphire technology we heisted from RCA.

Bad wafers were polished on the deposition side with 2000 grit polishing compound. Shining a high powered white light or a helium-neon Laser through the wafer sure gave an interesting light pattern on a white screen.o_O
 
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